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Manufacturing System

  • 17
    LOADER The process of automatically supplying the PCB loaded on the magazine to the post-process through the pusher
  • 16
    SCREEN PRINTER The process of printing Solder Cream on a single-sided or double-sided PCB pad
  • 15
    SPI The process of inspecting the volume of the printed Solder Paste
  • 14
    MOUNT The process of mounting various types of SMDs on the PCB pad surface printed with Solder Cream
  • 13
    REFLOW The process of curing and attaching the Solder Cream by heating the PCB equipped with SMD to a high temperature
  • 12
    AOI The process of inspecting the appearance state (defective contact, defective soldering, etc.) of the PCB
  • 11
    ICT The process of inspecting the characteristics of the circuit and component elements of the PCB
  • 10
    UNLOADER The process of automatically loading the transmitted PBA into Magazine
  • 9
    FCT The process of checking the overall circuit operation of the mounted PCB
  • 8
    COATING The process of applying a protective coating solution to the PBA on which the parts are mounted
  • 7
    ROUTER The process of separating the PBA in the Array state
  • 6
    PRESS The process of notching and bending the heatsink parts in the array state
  • 5
    ASSY The process of assembling (settling) PBA and COVER
  • 4
    STAKING The process of compressing and fixing the assembled MODULE with heat and pressure
  • 3
    VISION INSPECTION A process of determining a defective product by checking the amount of light and electrical SPEC output after applying a voltage (current) to the assembled product
  • 2
    VISUAL INSPECTION The process of visually inspecting the completed MODULE product
  • 1
    PACKING Final packaging

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