Please Wait....
KOR
ENG
About US
About KumhoHT
Vision
KumhoHT History
CI
KumhoHT People
Locations
KumhoHT News
Products
LAMP
LED MODULE
3D Show Room
Manufacturing System
Reliability Test Center
R&D Center
R&D Road-Map
R&D Field
Patent application Status
Sustainability
Quality
Ethics
Bio-Tech Business
R&D
Product
Investors
Performance
Stock Information
IR Reports
Announcement
About US
About KumhoHT
Vision
KumhoHT History
CI
KumhoHT People
Locations
KumhoHT News
Products
LAMP
LED MODULE
3D Show Room
Manufacturing System
Reliability Test Center
R&D Center
R&D Road-Map
R&D Field
Patent application Status
Sustainability
Quality
Ethics
Bio-Tech Business
R&D
Product
Investors
Performance
Stock Information
IR Reports
Announcement
KO
EN
Products
About US
Products
R&D Center
Sustainability
Bio-Tech Business
Investors
Manufacturing System
LAMP
LED MODULE
3D Show Room
Manufacturing System
Reliability Test Center
Manufacturing System
Manufacturing System 카테고리
open category
LED MODULE production process
LAMP production process
17
LOADER
The process of automatically supplying the PCB loaded on the magazine to the post-process through the pusher
16
SCREEN PRINTER
The process of printing Solder Cream on a single-sided or double-sided PCB pad
15
SPI
The process of inspecting the volume of the printed Solder Paste
14
MOUNT
The process of mounting various types of SMDs on the PCB pad surface printed with Solder Cream
13
REFLOW
The process of curing and attaching the Solder Cream by heating the PCB equipped with SMD to a high temperature
12
AOI
The process of inspecting the appearance state (defective contact, defective soldering, etc.) of the PCB
11
ICT
The process of inspecting the characteristics of the circuit and component elements of the PCB
10
UNLOADER
The process of automatically loading the transmitted PBA into Magazine
9
FCT
The process of checking the overall circuit operation of the mounted PCB
8
COATING
The process of applying a protective coating solution to the PBA on which the parts are mounted
7
ROUTER
The process of separating the PBA in the Array state
6
PRESS
The process of notching and bending the heatsink parts in the array state
5
ASSY
The process of assembling (settling) PBA and COVER
4
STAKING
The process of compressing and fixing the assembled MODULE with heat and pressure
3
VISION INSPECTION
A process of determining a defective product by checking the amount of light and electrical SPEC output after applying a voltage (current) to the assembled product
2
VISUAL INSPECTION
The process of visually inspecting the completed MODULE product
1
PACKING
Final packaging
검색
검색대상
제목
내용
제목+내용
글쓴이
글쓴이(코)
검색어
필수
검색
닫기